Solidification Process and Volume Fraction in Sn-Ag-Cu Alloy
نویسندگان
چکیده
منابع مشابه
Influence of the thermal history and composition on the melting/solidification process in Sn-Ag-Cu solders
Presented work shows the results of DSC measurement for six Sn based solders. The alloys Sn96Ag4, Sn99Cu1, Sn97Cu3, Sn96.5Ag3Cu0.5, Sn95.5Ag3.8Cu0.7 and Sn63Pb37 were studied in the temperature range from room temperature up to 400◦C. The transformation temperatures for melting as well as for solidification were influenced by the composition and thermal history of the alloys. The thermal histor...
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Ag-28.1 wt. % Cu eutectic alloy solidifies in the form of eutectic dendrite at undercooling above 76 K. The remelting and ripening of the original lamellar eutectics result in the formation of the anomalous eutectics in the final microstructure. The addition of the third element Sb (0.5 and 1 wt. %) does not change the growth mode, but enlarges the volume fraction of anomalous eutectics because...
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The microsegregation behavior of electron beam (EB, and gas tungsten arc (GTA) welds of Al-Cu alloys covering a range from 0.19 to 7.74 wt% Cu were characterized for dendrite core concentrations and fraction eutectic solidification. Although a single weld speed of 12.7 mm/sec was used, some differences were observed in the segregation behavior of the two weld types. The microsegregation behavio...
متن کاملTHERMAL ANALYSIS OF Ag-Cu-In-Sn SYSTEM
In this paper, the results of DSC analysis in Ag-Cu-In-Sn system are presented. Ten samples from the section with constant molar ratio (In:Ag:Cu=7:2:1) were investigated in order to obtain characteristic temperatures of each alloy. The results confirmed the influence of indium on thermal behaviour of these alloys.
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ژورنال
عنوان ژورنال: Journal of Japan Institute of Electronics Packaging
سال: 2010
ISSN: 1343-9677,1884-121X
DOI: 10.5104/jiep.13.521